The Future of Electronics Packaging is Spintronics, Says Professor Ekere

The Future of Electronics Packaging is Spintronics, Says Professor Ekere

Professor Nduka Ekere, a visiting International Scholar to Covenant University, making his presentation as the Guest Speaker at the College of Engineering Seminar Series. He posited that though technically challenging, miniaturisation had its benefits because making things smaller had its advantages. Miniaturisation, he said, had happened through two parallel lines, which included the top-down approach of semi-contractors and microelectronics, and the development of plasma silicon technology and the integration of components and functions.